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20 积分 2025-04-21 加入
Reliability of TSV interconnects: Electromigration, thermal cycling, and impact on above metal level dielectric
6天前
已完结
Effects of stress and temperature gradients on the evolution of void in metal interconnects driven by electric current and mechanical stress
6天前
已关闭
Effects of stress and temperature gradients on the evolution of void in metal interconnects driven by electric current and mechanical stress
6天前
已关闭
Investigation of the effect of temperature and stress gradients on accelerated EM test for Cu narrow interconnects
6天前
已完结
Electromigration reliability issues in dual-damascene Cu interconnections
7天前
已完结
High-Frequency Scalable Electrical Model and Analysis of a Through Silicon Via (TSV)
11天前
已完结
Analytical Model for Cu Interconnect Lifetimes Under Combined Thermomigration and Electromigration Stress
13天前
已关闭
Simulation on Interplay Between Morphological Evolution and Defect in Polycrystalline TSV During EM
13天前
已完结
Copper Electromigration Improvement Through Aluminum Barrier and Related Process Optimization
21天前
已完结
Effect of silicon nitride capping layer on via electromigration and failure criterion methodology in multilevel interconnection
28天前
已完结
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