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50 积分 2025-04-21 加入
The reliability of copper pillar under the coupling of thermal cycling and electric current stressing
16天前
已完结
Peridynamic modeling of void nucleation and growth in metal lines due to electromigration in a finite element framework
22天前
已关闭
Prediction of electromigration failure in passivated polycrystalline line
22天前
已完结
Accelerated Life Test and Prediction of Electromigration in Aluminum Interconnects coupling Multiphysics Full Coupled Model with Optimized Atomic Flux Divergence Simulation
1个月前
已完结
Exploring Cu-Cu Hybrid Bonding Failure Mechanisms under Current Stress via 3D Focused Ion Beam Tomography
1个月前
已完结
Atomic-Scale Investigation of Electromigration Behavior in Cu-to-Cu Joints at High Current Density
1个月前
已关闭
Effect of Microstructure on the Electromigration Performance of 2- μm-Cu Redistribution Line under In-situ SEM Observation
1个月前
已关闭
Study of initial void formation and electron wind force for scaling effects on electromigration in Cu interconnects
1个月前
已关闭
An Efficient Approach for Combined Electromigration and Thermomigration Analysis Based on the Extended Krylov Subspace
1个月前
已完结
Modeling the Resistance Variation of Heterogeneous Integrated Interconnect Structures under Electrical Stress
1个月前
已完结
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