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A Multiphysics Simulation Framework for Electromigration Risk Assessment in Modern Interconnects
1天前
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Evaluation of Electromigration Coupling Different Physics Fields in Numerical Simulation
1天前
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Investigation on Electromigration Failure Mechanism and Lifetime Prediction of Interconnects Under Multifield Coupling for Chiplet Applications
1天前
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Reliability of TSV interconnects: Electromigration, thermal cycling, and impact on above metal level dielectric
8天前
已完结
Effects of stress and temperature gradients on the evolution of void in metal interconnects driven by electric current and mechanical stress
8天前
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Effects of stress and temperature gradients on the evolution of void in metal interconnects driven by electric current and mechanical stress
8天前
已关闭
Investigation of the effect of temperature and stress gradients on accelerated EM test for Cu narrow interconnects
8天前
已完结
Electromigration reliability issues in dual-damascene Cu interconnections
9天前
已完结
High-Frequency Scalable Electrical Model and Analysis of a Through Silicon Via (TSV)
13天前
已完结
Analytical Model for Cu Interconnect Lifetimes Under Combined Thermomigration and Electromigration Stress
15天前
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