Lv1
30 积分 2025-04-21 加入
Prediction of electromigration lifetime of copper pillar bumps in ceramic packaging device
5天前
已完结
Electromigration Study on Micro-vias of Multi-layer Anodic Alumina Substrate with a Thermal Compensated on-line Measurement Scheme
5天前
已完结
Recent Applications of Focused Ion Beam–Scanning Electron Microscopy in Advanced Packaging
6天前
已完结
Simulation on Microstructural Evolution under Electromigration in Backside Power Delivery Network
6天前
已完结
Twin-aware Monte Carlo simulation of microstructural evolution in copper through-silicon vias (TSVs) based on EBSD-initiated microstructures
6天前
已完结
Revisit to the finite element modeling of electromigration for narrow interconnects
24天前
已完结
Electro- and thermo-migration induced failure mechanisms in Package on Package
28天前
已完结
Atomic migration on Cu in Sn-58Bi solder from the interaction between electromigration and thermomigration
28天前
已完结
3D Modeling of Electromigration Combined with Thermal-Mechanical Effect for IC Device and Package
1个月前
已完结
Electromigration simulation with consideration of the atomic concentration gradient
1个月前
已完结
皖公网安备34019202002308
