| 标题 |
[高分]
Soft Defect Localization and Characterization for Advanced IC Packaging Using Novel EOTPR In-Situ Dynamic Temperature Probing |
| 网址 | |
| DOI |
10.31399/asm.cp.istfa2022p0289
doi
|
| 其它 |
期刊:International Symposium for Testing and Failure Analysis 作者:Zhi Hao Ko; Tom White; Jesse Alton; Martin Igarashi 出版日期:2022-10-30 |
| 求助人 | |
| 下载 |
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(2025-6-4)