| 标题 |
A 0.29 pJ/b 5.27 Tb/s/mm UCIe Advanced Package Link With 2.5-D CoWoS Interposer and a 0.52 pJ/b 0.448 Tb/s/mm UCIe Standard Package Link With Organic Substrate in 3 nm FinFET |
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| DOI | |
| 其它 |
期刊:IEEE Journal of Solid-state Circuits 作者:Didem Turker Melek; James Vandersand; R. Navin Kumar; Pyare Sarkar; Prakash BS; et al 出版日期:2026-02-11 |
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(2025-6-4)