| 标题 |
Relationship between free solder thickness to the solderability of Sn–0.7Cu–0.05Ni solder coating during soldering |
| 网址 | |
| DOI | |
| 其它 |
期刊:Journal of Materials Science: Materials in Electronics 作者:M. I. I. Ramli; M. A. A. Mohd Salleh; F. A. Mohd Sobri; P. Narayanan; K. Sweatman; K. Nogita 出版日期:2019 |
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(2025-6-4)