| 标题 |
The influence of pulse plating frequency and duty cycle on the microstructure and stress state of electroplated copper films |
| 网址 | |
| DOI | |
| 其它 |
期刊:Thin Solid Films 作者:James Marro; Taghi Darroudi; Chukwudi Okoro; Yaw S. Obeng; Kathleen C. Richardson 出版日期:2016-11-30 |
| 求助人 | |
| 下载 |
PDF的下载单位、IP信息已删除
(2025-6-4)