| 标题 |
Selective Desoldering Separation of Tin–Lead Alloy for Dismantling of Electronic Components from Printed Circuit Boards |
| 网址 | |
| DOI | |
| 其它 |
期刊:ACS Sustainable Chemistry & Engineering 作者:Xiaojiao Zhang; Jie Guan; Yaoguang Guo; Xingru Yan; Hao Yuan; et al 出版日期:2015-06-17 |
| 求助人 | |
| 下载 | 求助已完成,仅限求助人下载。 |
PDF的下载单位、IP信息已删除
(2025-6-4)