| 标题 |
Improving the mechanical performance of Sn57.6Bi0.4Ag solder joints on Au/Ni/Cu pads during aging and electromigration through the addition of tungsten (W) nanoparticle reinforcement |
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| DOI | |
| 其它 |
期刊:Materials Science and Engineering: A 作者:Yi Li; Kaiming Luo; Adeline B.Y. Lim; Zhong Chen; Fengshun Wu; et al 出版日期:2016-07-01 |
| 求助人 | |
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(2025-6-4)