| 标题 |
Thermo-Mechanical Reliability of Sintered Silver Die Attach on Thick Copper Substrates |
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| DOI | |
| 其它 |
期刊:IEEE Transactions on Power Electronics 作者:Narayanan Rajagopal; Taha Moaz; Isla Carlson; Jack Knoll; Christina DiMarino 出版日期:2026-12-01 |
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(2025-6-4)