| 标题 |
Formation of Glass Microcrack Induced by Nonuniform Copper Grain Growth in Through Glass Via During Reflow Soldering |
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| 其它 |
期刊:2025 26th International Conference on Electronic Packaging Technology (ICEPT) 作者:Jun Huang; Jianxiong Liu; Enliang Li; Jianxiong Liu; Xuanlong Chen; et al 出版日期:2025-08-05 |
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(2025-6-4)