| 标题 |
A Numerical Approach for Predicting Temperature Distribution, Heat Flow, and Material Deformation of Printed Circuit Board during Laser Soldering |
| 网址 | |
| DOI | |
| 其它 |
期刊:Journal of Advanced Research in Applied Mechanics 作者: Saliza Azlina Osman; Saikat Barua; Dayang Izzah Nabilah Awang Azman; Noor Izza Noor Hamdan; Iman Nur Sazniza Johari 出版日期:2024-01-07 |
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(2025-6-4)