| 标题 |
Toward TSV-Compatible Microfluidic Cooling for 3D ICs |
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| 其它 |
求助全文 PDF,谢谢! DOI: 10.1109/TCPMT.2024.3516653 标题: Toward TSV-Compatible Microfluidic Cooling for 3D ICs 作者: Geyu Yan; Euichul Chung; Erik Masselink; Shane Oh; Muneeb Zia; Bharath Ramakrishnan; Vaidehi Oruganti; Husam Alissa; Christian Belady; Yunhyeok Im; Yogendra Joshi; Muhannad S. Bakir 期刊: IEEE Transactions on Components, Packaging and Manufacturing Technology 年份: 2025 |
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(2025-6-4)