| 标题 |
The Effect of Double-Layer Nonconductive Films on the Solder Sidewall Wetting and the Reliability of 40-$\mu$ m Cu-Pillar/SnAg Microbumps for Chip-on-Chip Interconnection |
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| DOI | |
| 其它 |
期刊:IEEE Transactions on Components, Packaging and Manufacturing Technology 作者:SeYong Lee; HanMin Lee; SangMyung Shin; MinGu Jang; TaeJin Choi; et al 出版日期:2019-06-01 |
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(2025-6-4)