| 标题 |
High frequency, low cost, power packaging using thin film power overlay technology |
| 网址 | |
| DOI | |
| 其它 |
期刊:Proceedings of 1995 IEEE Applied Power Electronics Conference and Exposition - APEC'95 作者:R. Fisher; R. Fillion; J. Burgess; W. Hennessy 出版日期:1995-01-01 |
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(2025-6-4)