| 标题 |
High-Performance Thermal and Electrical Characteristics of Via-Last (BBCube) Process in Multi-Layer 3D Integration |
| 网址 | |
| DOI | |
| 其它 |
期刊:2024 IEEE 74th Electronic Components and Technology Conference (ECTC) 作者:Norio Chujo; Hiroyuki Ryoson; Koji Sakui; Shinji Sugatani; Masao Taguchi; Takayuki Ohba 出版日期:2024 |
| 求助人 | |
| 下载 |
PDF的下载单位、IP信息已删除
(2025-6-4)