| 标题 |
Cu–Cu bonding process in 3D integrated circuits: thermo-mechanical coupling challenges and reliability-driven solutions |
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| DOI | |
| 其它 |
期刊:The International Journal of Advanced Manufacturing Technology 作者:Yong-Jie Wong; M. S. Abdul Aziz; C. Y. Khor; M. H. H. Ishaik; Kim Hoey Yeoh; et al 出版日期:2026-09-09 |
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(2025-6-4)