| 标题 |
Design Optimization of Through-Silicon Vias for Substrate-Integrated Waveguides embedded in High-Resistive Silicon Interposer |
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期刊:2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) 作者:M. Wietstruck; S. Marschmeyer; S. Tolunay Wipf; C. Wipf; T. VoΒ; et al 出版日期:2019-03-19 |
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(2025-6-4)