| 标题 |
Durability distribution prediction of thermo-mechanical solder fatigue failure with uncertainty propagation by eigenvector dimension reduction method |
| 网址 | |
| DOI | |
| 其它 |
期刊:Microelectronics Reliability 作者:Chien-Ming Huang; Jeffrey W. Herrmann 出版日期:2024-10-01 |
| 求助人 | |
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(2025-6-4)