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Microstructure and nanoindentation creep behavior of NiAlCrFeMo high-entropy alloy
26天前
已完结
Creep behaviour and microstructure evolution of the CuCrZrTiVY alloy
26天前
已完结
Stacked solder bumping technology for improved solder joint reliability
26天前
已关闭
The effect of joint size on the creep properties of microscale lead-free solder joints at elevated temperatures
26天前
已完结
A review of extreme condition effects on solder joint reliability: Understanding failure mechanisms
26天前
已完结
Creep of Sn-0.3Ag-0.7Cu solder in electronic packaging: Experiment and simulation
26天前
已关闭
Realistic Creep Characterization for Sn3.0Ag0.5Cu Solder Joints in Flip Chip BGA Package
26天前
已完结
Grain effect, creep analysis, and machine learning of Sn-3Ag-0.5Cu solder joint of BGA package under thermal shock test
26天前
已完结
Effect of Creep, Fatigue and Random Vibration on the Integrity of Solder Joints in BGA Package
26天前
已完结
Composite of Ge and α-MnSe in carbon nanofibers as a high- performance anode material for LIBs
3个月前
已完结
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