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2028 积分 2025-12-24 加入
Microstructures, mechanical properties and reliability induced from size effect in Sn-based solder joints: Review
1天前
已完结
Critical Review of Size Effects on Microstructure and Mechanical Properties of Solder Joints for Electronic Packaging
1天前
已完结
Advanced semiconductor packaging design via artificial intelligence and machine learning: A review
1天前
已完结
An Overview of AI-Assisted Design-on-Simulation Technology for Reliability Life Prediction of Advanced Packaging
1天前
已完结
Failure analysis of interconnections and bi-material interfaces in microelectronic packages and semiconductors: A review
1天前
已关闭
Effect of Sn Grain Orientation on Reliability Issues of Sn-Rich Solder Joints
1天前
已完结
Anisotropy-induced reliability issues and grain orientation control in Sn-based micro solder joints for advanced packaging
1天前
已完结
Thermomechanical Challenges of 2.5-D Packaging: A Review of Warpage and Interconnect Reliability
1天前
已完结
Pb-Free Solder Joint Thermo-Mechanical Modeling: State of the Art and Challenges
1天前
已完结
Energy based modeling for temperature cycling induced tin silver copper solder interconnect fatigue life
1天前
已完结
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