Lv4
478 积分 2025-12-24 加入
Anand Model and Finite Element Analysis of Sn-0.3Ag-0.7Cu-3Bi Lead-Free Solder Joints in BGA Packages
20天前
已完结
Creep in microelectronic solder joints: finite element simulations versus semi-analytical methods
20天前
已完结
Review of microstructure and properties of low temperature lead-free solder in electronic packaging
1个月前
已完结
Effect of Thermal Aging on the Mechanical Properties of SAC305
1个月前
已完结
Inhibition of Bi segregation in Sn-58Bi/Cu solder joint by controlling the grain of Cu substrate
1个月前
已完结
Enhancement of structure and properties of Sn58Bi solder by AlN ceramic particles
1个月前
已完结
Effects of Ag3Sn nanoparticles and isothermal aging on IMC layer growth, mechanical properties, and life prediction of SAC305/Cu solder joints
1个月前
已完结
Study of microstructure, growth orientations and shear performance of Cu/Sn-3.0Ag-0.5Cu/Cu solder joints by using thermal gradient bonding
1个月前
已完结
The influences of microstructural length scale on the tensile properties and deformation mechanisms of Sn-3.0Ag-0.5Cu solder alloys
1个月前
已完结
Microstructure changes in Sn-Bi solder joints reinforced with Zn@Sn particles in thermal cycling and thermomigration
1个月前
已完结
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