Lv4
470 积分 2025-12-24 加入
Finite Element Analysis of the Thermal Cycling Performances of PBGA Assemblies Subjected to Various Prior Isothermal Aging Conditions
26天前
已完结
Comparison of Tensile and Creep Properties of SAC305 and SACX0807 at Room Temperature with DIC Application
26天前
已完结
Creep behavior of Sn58Bi solder alloy: experiments and modeling
26天前
已完结
Event-triggered-based switching law design for switched systems
1个月前
已完结
Anand Model and Finite Element Analysis of Sn-0.3Ag-0.7Cu-3Bi Lead-Free Solder Joints in BGA Packages
2个月前
已完结
Creep in microelectronic solder joints: finite element simulations versus semi-analytical methods
2个月前
已完结
Review of microstructure and properties of low temperature lead-free solder in electronic packaging
3个月前
已完结
Effect of Thermal Aging on the Mechanical Properties of SAC305
3个月前
已完结
Inhibition of Bi segregation in Sn-58Bi/Cu solder joint by controlling the grain of Cu substrate
3个月前
已完结
Enhancement of structure and properties of Sn58Bi solder by AlN ceramic particles
3个月前
已完结
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