| 标题 |
 Viscoplastic Constitutive Model for Lead-Free Solder Including Effects of Silver Content, Solidification Profile, and Severe Aging |
| 网址 | |
| DOI |
10.1115/ipack2015-48619
doi
|
| 其它 |
期刊：Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales 作者：Munshi Basit; Mohammad Motalab; Jeffrey C. Suhling; Pradeep Lall 出版日期：2015-07-06 |
| 求助人 | |
| 下载 | 求助已完成，仅限求助人或该文件上传人下载。 |
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(2025-6-4)
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