| 标题 |
Effect of Ag addition on the mechanical properties of Cu/Ni/Sn/Ni/Cu microbump with a sub-10 micron bump thickness |
| 网址 | |
| DOI | |
| 其它 |
期刊:Journal of Materials Science: Materials in Electronics 作者:Yi-Chen Li; Yin-Ku Lee; Zih-You Wu; Su-Yueh Tsai; Shou-Yi Chang; et al 出版日期:2024-10-01 |
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(2025-6-4)