| 标题 |
Integrating mechanical integrity and electrochemical stability in structural supercapacitors via dual-Fiber encapsulation and vacuum assisted resin transfer molding processing |
| 网址 | |
| DOI | |
| 其它 |
期刊:Journal of Energy Storage 作者:Chun-Lung Fan; Wen-Bin Young 出版日期:2026-04-01 |
| 求助人 | |
| 下载 | 求助已完成,仅限求助人或该文件上传人下载。 |
PDF的下载单位、IP信息已删除
(2025-6-4)