| 标题 |
28GHz Through Glass Via (TGV) Based Band Pass Filter Using Through Fused Silica Via (TFV) Technology |
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| DOI | |
| 其它 |
期刊:2019 IEEE 69th Electronic Components and Technology Conference (ECTC) 作者:Renuka Bowrothu; Seahee Hwangbo; Todd Schumann; Yong-Kyu Yoon 出版日期:2019-05-01 |
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(2025-6-4)