| 标题 |
Influence of IMC morphology on fatigue stress, strain and life of solder layer between SiC chip and DBC substrate in IGBT under thermal cycling |
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| DOI | |
| 其它 |
期刊:2021 22nd International Conference on Electronic Packaging Technology (ICEPT) 作者:Guang Yang; Fengshun Wu; Longzao Zhou; Xinghe Luan; Xinrui Zou; et al 出版日期:2021-09-14 |
| 求助人 | |
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(2025-6-4)