| 标题 |
Board-Level Drop Reliability Analysis for Fine-Pitch BGA Packages in Automotive Applications |
| 网址 | |
| DOI | |
| 其它 |
期刊:CPMT Symposium Japan 作者:W. Lai; Hung-Chun Yang; Meng-Chi Hsu; C. Kao; C. Hung 出版日期:2023-11-15 |
| 求助人 | |
| 下载 |
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(2025-6-4)