| 标题 |
Low-temperature curing polyimide composites with low coefficient of thermal expansion for high-temperature electronic packaging |
| 网址 | |
| DOI |
10.26599/nr.2025.94907310
doi
|
| 其它 |
期刊:Nano Research 作者:Tianqi Hou; Chuan He; Ying Lin; Yushun Zhao; Lijian Ding 出版日期:2025-02-18 |
| 求助人 | |
| 下载 | 求助已完成,仅限求助人下载。 |
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(2025-6-4)