| 标题 |
 Ultra-Low-Temperature HF Plasma Etching: Mechanism, Scalability, and Environmental Impact for 3D NAND and GAA Devices |
| 网址 | |
| DOI |
10.1109/TED.2024.3412567
doi
|
| 求助人 | |
| 下载 |
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(2025-6-4)
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