| 标题 |
Ultra-Low-Temperature HF Plasma Etching: Mechanism, Scalability, and Environmental Impact for 3D NAND and GAA Devices |
| 网址 | |
| DOI |
10.1109/TED.2024.3412567
doi
|
| 求助人 | |
| 下载 | 暂无链接,等待应助者上传 |