| 标题 |
Study of migration and coalescence of voids driven by electric current stressing in solder interconnects using phase field simulation |
| 网址 | |
| DOI | |
| 其它 |
期刊:Microelectronics Reliability 作者:S. Liang; M.B. Zhou; C.B. Ke; C. Wei; X.P. Zhang 出版日期:2022-11-01 |
| 求助人 | |
| 下载 | 暂无链接,等待应助者上传 |
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(2025-6-4)