| 标题 |
[高分]
Electrical Properties of Copper-Filled Electrically Conductive Adhesives and Pressure-Dependent Conduction Behavior of Copper Particles |
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| DOI | |
| 其它 |
期刊:Journal of Adhesion Science and Technology 作者:Yung-Sen Lin; Sheng-Shiang Chiu 出版日期:2008-01-01 |
| 求助人 | |
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(2025-6-4)