| 标题 |
Relationship between thermal curing behavior and bond strength development in formaldehyde-based resins with different molecular weights |
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| DOI | |
| 其它 |
期刊:Journal of Adhesion Science and Technology 作者:E. Wibowo; Byung-Dae Park; J. Žigon; M. Šernek 出版日期:2024-02-07 |
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(2025-6-4)