| 标题 |
Reliability Assessment of Liquid Metal Alloy Thermal Interface Materials in Fan-Out Embedded Bridge (FO-EB) Packages |
| 网址 | |
| DOI | |
| 其它 |
期刊:2026 IEEE 76th Electronic Components and Technology Conference (ECTC) 作者:Wen-Yu Teng; Jyun-De Jhan; Dai-Fei Li; Shane Lin; Yung-Ta Li; et al 出版日期:2026 |
| 求助人 | |
| 下载 | 求助已完成,仅限求助人下载。 |
PDF的下载单位、IP信息已删除
(2025-6-4)