| 标题 |
Three-dimensional topology optimization and experimental validation of a novel microchannel heat sink for electronic cooling |
| 网址 | |
| DOI | |
| 其它 |
期刊:International Journal of Heat and Mass Transfer 作者:Hongyang Song; Dingbiao Wang; Xin Hong; Guanghui Wang; Sa Xiang; et al 出版日期:2026-12-01 |
| 求助人 | |
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(2025-6-4)