| 标题 |
Multi-branched Dilated Convolution with Feature Fusion and Dropout for Accurate Wafer Surface Defect Detection |
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| DOI | |
| 其它 |
期刊:IEEE Transactions on Instrumentation and Measurement 作者:Guang Yang; Zhijia Yang; Junzhang Pan; Yulin Miao; Shuping Cui 出版日期:2025-01-01 |
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(2025-6-4)