| 标题 |
Flexible phase change composite films with improved thermal conductivity and superb thermal reliability for electronic chip thermal management |
| 网址 | |
| DOI | |
| 其它 |
期刊:Composites Part A-applied Science and Manufacturing 作者:Yanqi Ma; Huichang Wang; Li Zhang; Xinxin Sheng; Ying Chen 出版日期:2022-09-17 |
| 求助人 | |
| 下载 |
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(2025-6-4)