| 标题 |
Two-metal-level semi-damascene interconnect at metal pitch 18 nm and aspect-ratio 6 routed using fully self-aligned via |
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| 其它 |
期刊:2023 International Electron Devices Meeting (IEDM) 作者:Anshul Gupta; Giulio Marti; Gilles Delie; Souvik Kundu; Stefan Decoster; et al 出版日期:2023-12-09 |
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(2025-6-4)