| 标题 |
Fatigue Life of Sn3.0Ag0.5Cu Solder Alloys Under Combined Shear and Compressive Loads |
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| DOI | |
| 其它 |
期刊:ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems 作者:Travis Dale; Yuvraj Singh; Ian Bernander; Ganesh Subbarayan; Carol Handwerker; et al 出版日期:2019 |
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(2025-6-4)