| 标题 |
Thermal Characteristic Investigation for a Multichip Module Based on APDL |
| 网址 | |
| DOI |
10.1155/2024/2028369
doi
|
| 其它 |
期刊:International Journal of RF and Microwave Computer-Aided Engineering 作者:Qian Lin; Peng-Fei Zhao; Rui-lan Yang; Hai-feng Wu 出版日期:2024-04-18 |
| 求助人 | |
| 下载 |
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(2025-6-4)