| 标题 |
Numerical Optimization of Thermally Induced Hysteresis Effects in the Packaging of MEMS Pressure Sensors |
| 网址 | |
| DOI | |
| 其它 |
期刊:IEEE Sensors Journal 作者:Andreas Dörfler; Gregor Feiertag; Matthias Schmidt; Andreas Ruediger; Ulrich Wagner 出版日期:2019-05-15 |
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(2025-6-4)