| 标题 |
Two-step sub-modeling framework for thermomechanical fatigue analysis of solder joints in DRAM module |
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| DOI | |
| 其它 |
期刊:Microelectronics Reliability 作者:Hyun Suk Lee; Giseok Yun; Ju-Hwan Song; Do-Nyun Kim 出版日期:2024-07-26 |
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(2025-6-4)