| 标题 |
High-Aspect-Ratio, 6-μm-Diameter Through-Glass-via Fabrication into 100-μm-Thick ENA1 by Dry Laser Micro-Drilling Process |
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| 其它 |
期刊:2025 IEEE 75th Electronic Components and Technology Conference (ECTC) 作者:Toshio Otsu; Tsubasa Endo; Akihiro Shibata; Yoichiro Sato; Hiroharu Tamaru; Yohei Kobayashi 出版日期:2025 |
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(2025-6-4)