| 标题 |
Sintering kinetics of silver joints: a semi-quantitative approach to predicting temperature-time sintering profiles |
| 网址 | |
| DOI | |
| 其它 |
期刊:Journal of Materials Science: Materials in Electronics 作者:Jingwen Liu; Huaming Mao; Maoyin Yan; Shijun Huang; Mulan Li; et al 出版日期:2026-05-01 |
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(2025-6-4)