| 标题 |
Effect of barrier thickness on electromigration reliability of Cu/porous low k interconnects |
| 网址 | |
| DOI | |
| 其它 |
期刊:Applied Physics Letters 作者:Jung Woo Pyun; Xia Lu; Jayhoon Chung; Sean Yoon; Paul S. Ho; et al 出版日期:2005-08-03 |
| 求助人 | |
| 下载 |
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(2025-6-4)