| 标题 |
Thermal–Electrical Modeling and Co-Optimization of a Half-Bridge Power Module With Silver- Sintered Molybdenum Packaging |
| 网址 | |
| DOI | |
| 其它 |
期刊:IEEE transactions on power electronics 作者:Yuhang Yang; Linke Zhou; Omar Zayed; Maryam Alizadeh; Doris Stevanović; et al 出版日期:2023-09-01 |
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(2025-6-4)