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S.W. Kim, M.M. Rehman, M. Sajid, M.M. ur Rehman, J. Gul, J. Dai Jo, K.H. Choi, Encapsulation of polyvinyl alcohol based flexible temperature sensor through spatial atmospheric atomic layer deposition system to enhance its lifetime, Thin Solid Films 673 (2019) 44–51, |
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(2025-6-4)