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Electrochemical additive manufacturing-based cold plate with distributed inlet nozzles and outlet slots for high-power-density electronics cooling |
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期刊:Applied Thermal Engineering 作者:Sangram Kumar Samal; Pang-Chieh Yu; Hsien-Chun Chang; Yogesh Fulpagare; Ian Winfield; et al 出版日期:2026-03-21 |
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(2025-6-4)