| 标题 |
Thermomechanical Challenges of 2.5-D Packaging: A Review of Warpage and Interconnect Reliability |
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| DOI | |
| 其它 |
期刊:IEEE Transactions on Components, Packaging and Manufacturing Technology 作者:Hakjun Kim; Jae Young Hwang; Sarah Eunkyung Kim; Young‐Chang Joo; Hyejin Jang 出版日期:2023-09-20 |
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(2025-6-4)