| 标题 |
Study on the impact of gold-tin solder reflow on the packaging quality of high-power semiconductor lasers |
| 网址 | |
| DOI |
10.1117/12.3110187
doi
|
| 其它 |
期刊:International Conference on Optoelectronic Materials and Devices (ICOMD 2025) 作者:Zebang Liu; Chunyan Tao; Mingming Hao 出版日期:2026-05-18 |
| 求助人 | |
| 下载 | 该求助完结已超 24 小时,文件已从服务器自动删除,无法下载。 |
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(2025-6-4)