| 标题 |
New observations on intermetallic compound formation in gold ball bonds: general growth patterns and identification of two forms of Au4Al |
| 网址 | |
| DOI | |
| 其它 |
期刊:Microelectronics and reliability 作者:C. Breach; F. Wulff 出版日期:2004-06-01 |
| 求助人 | |
| 下载 |
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(2025-6-4)