| 标题 |
Surface modification of silver nanoparticles with self-assembled monolayers to mitigate electrochemical migration in fine-pitch interconnects |
| 网址 | |
| DOI | |
| 其它 |
期刊:Surfaces and Interfaces 作者:Chia-Hung Tsou; Wan-Hsuan Lin; Chien-Cheng Chiang; Fan-Yi Ouyang 出版日期:2026 |
| 求助人 | |
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(2025-6-4)