| 标题 |
Role of thermal stress-driven dislocation and low-angle grain boundary migration in surface plastic deformation and grain orientation evolution of tungsten under thermal shock |
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| DOI | |
| 其它 |
期刊:International Journal of Plasticity 作者:Meng-Chong Ren; Yu-Fei Nie; Han-Qing Wang; Yue Yuan; Fan Feng; et al 出版日期:2025-01-01 |
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(2025-6-4)