| 标题 |
Viscoplastic characterization and post-rupture microanalysis of a novel lead-free solder with small additions of Bi, Sb and Ni |
| 网址 | |
| DOI | |
| 其它 |
期刊:Journal of Alloys and Compounds 作者:Q.B. Tao; L. Benabou; V.N. Le; H. Hwang; D.B. Luu 出版日期:2017-02-01 |
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(2025-6-4)